Front Range Professional Speaker Series
Connecting students, researchers, and industry professionals through technical talks on signal integrity, packaging, PCB design, interconnects, power integrity, and modern high-performance computing.
Presented in association with CU Boulder’s High Speed Digital Engineering (HSD) Program.
The hardware story
Follow the signal path from modern chiplets through advanced packaging and printed circuit boards to complete computing systems.
Why so many dies?
How are the dies connected?
How does the board preserve signal and power integrity?
How does it scale to complete systems?
Fall 2026
Register for individual talks — or plan to attend the full series.
Chris Fieldsend LinkedIn ↗Marvell
Explore advanced packaging technologies that enable higher performance, density, and connectivity in modern computing systems.
Register for Sept. 10
Judd Gerber Intel
Understand why chiplets are becoming central to modern processor design, how they are partitioned, and where they fit in next-generation systems.
Talk abstract + event details →
Register for Oct. 8
Darren Hitchcock LinkedIn ↗Panasonic
Learn how package and PCB material choices affect signal integrity, manufacturability, and performance in high-speed systems.
Register for Nov. 5Student Presentations CU Boulder
Student presentations showcasing research and industry topics, with the same discussion-focused format as the professional talks.
Coming next
More details and registration links will be added as speakers are confirmed.
Interconnect topic planned
Speaker details coming soon
CU Boulder students
Students using the series for course credit should register for each talk and check in at the event. Attendance and no-show records may be shared with the participating course instructor.
Course credit and any no-show consequence are determined by the individual instructor. If plans change, cancel your registration before the event.
Industry & community
Registration is open to industry professionals and community attendees using any email address. The registration form will collect organization and role information so participation can be understood across students, faculty, and industry.
IEEE membership information and a separate opt-in for sharing professional contact or attendance information with the local IEEE organization can be included in registration.
The series is presented in association with CU Boulder’s High Speed Digital Engineering professional master’s program.
Learn about the HSD Program →