Event Photos
Coming after Sept. 10.
Speaker bio
About Chris
Chris Fieldsend serves as Director, Advanced Packaging at Marvell Semiconductor in Burlington, VT, where he leads global engineering teams designing and validating advanced semiconductor packaging solutions for custom computing products, including XPU hardware, custom memory expanders, and leading-edge technology development vehicles.
With over two decades of engineering and leadership in semiconductor test and characterization, load board and probe card development, and package design, Chris brings deep industry expertise across the entire semiconductor ecosystem. Prior to joining Marvell, he served as Senior Engineering Manager at IBM, responsible for test lab operations and hardware development, including worldwide wafer and module test hardware solutions for flagship enterprise microprocessors and quantum control modules.
Chris is passionate about fostering growth in early career professionals, leading high energy and deeply talented teams, and holds a unique perspective on career progression in the semiconductor industry.
About the talk
Advanced Packaging
Explore advanced packaging technologies that enable higher performance, density, and connectivity in modern computing systems.
Event archive
After the Talk
This page will become the permanent archive for the Sept. 10 event. Photos, presentation materials, and recordings will be added here after the talk as they become available.
Presentation PDF
Coming after the event, if available for sharing.
Recording
Coming after the event, if a recording is available.